Lead-Free Solder Paste – Pack of 2

HXP-603 lead-free solder paste for precision electronics work and PCB repair. Supplied as a pack of two.

• Supplier-stated alloy: Sn99/Ag0.3/Cu0.7
• Tin 99%, Silver 0.3%, Copper 0.7%
• Supplier-stated melting point: approximately 217°C
• Pack quantity: 2 units
• Designed for suitable lead-free soldering and rework processes

What does each metal do?

• Tin (99%) – The primary soldering metal, forming the electrical and mechanical connection.

• Silver (0.3%) – Helps improve the solder alloy's mechanical properties and joint reliability.

• Copper (0.7%) – Helps control copper dissolution and contributes to solder-joint performance.

Important: Use ventilation and avoid breathing fumes. Lead-free does not mean hazard-free.