Sn63Pb37 Leaded Solder Paste – 35g Syringe

YH-806 Sn63Pb37 solder paste contains 63% tin and 37% lead, providing excellent solder flow, reliable electrical connections and a low melting point of approximately 183°C. Its eutectic formulation makes it particularly useful for precision electronics soldering, PCB repairs and fine model railway wiring.

• Alloy: 63% tin / 37% lead
• Pack: one 35g syringe
• Typical Sn63Pb37 melting point: approximately 183°C
• Suitable for appropriately equipped electronics repair and fine soldering applications

What does each metal do in Sn63Pb37 solder paste?

- Tin (63%) – The primary soldering metal, providing good electrical conductivity and forming a strong metallurgical bond with copper and other solderable surfaces.

- Lead (37%) – Improves solder flow and wetting, helping the molten solder spread evenly across connections. It also contributes to a lower melting temperature and makes solder joints easier to work with.

Why is the 63/37 combination useful?

Sn63Pb37 is known as a eutectic solder alloy, meaning it melts and solidifies at a single temperature of approximately 183°C, rather than across a temperature range.

This provides several advantages for electronics work:

• Good solder flow and wetting.

• Reduced risk of disturbed or cold joints during cooling.

• Lower soldering temperatures than many lead-free alternatives.

• Suitable for fine electronics work, including model railway DCC decoder installations and PCB repairs.

Important: Contains lead. Use appropriate ventilation, avoid inhaling fumes, wash hands after handling and keep away from children. Refer to the manufacturer's safety data sheet and instructions. Not for food-contact applications.